BM900

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BM900

BM900

Industrial screen repair machine

$6,361 USD(≈ ¥45,800 RMB)
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DDIC Machine
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Technical Specifications

ModelCOP/COG Rework Bonding Module
Body MaterialImported aluminum, anodized
Dimensions1200×610×1320mm
Power SupplyAC220V 50/60Hz
Air Supply0.4-0.6MPa
Power1500W
Bonding Head Size32×2.2mm / 40×3.0mm / 57×1.0mm (customizable)
Bonding Accuracy±3μm (pre/main), ±5μm (pre-main)
Weight≈169kg
Applicable Size2.4-7.0inch

Key Features

  • Three-station integrated structure, stable, low vibration
  • Self-developed vision alignment system, easy operation
  • High-definition alignment, corrects COP rework deformation
  • Panasonic servo motor + HIWIN linear guide, high repeatability
  • Designed for actual COP rework process
  • COP main bonding with bottom camera
  • COP pre-bonding with bottom camera
  • Suitable for full COP/COG bonding process

Application Scenarios

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