EN-801S COP/COG DDIC Pre-bonding Machine #
High-precision IC pre-bonding system for COG/COF chip-on-glass and chip-on-flex applications.
Key Specifications #
- Structure: Aluminum alloy, surface oxidation, flatness ±0.02mm
- Size: 650 × 550 × 750 mm
- Work environment: Clean room
- Power: 600W, AC220V 50/60Hz
- Air source: 0.4–0.6 Mpa clean dry compressed air
- Head size: 33 × 2.0 mm (customizable)
- Hot pressing accuracy: ±3 μm
- Working platform: 180 × 170 mm / inclined platform
- Net weight: ≈56 kg
Equipment Features #
- Desktop device, aluminum alloy body, surface oxidation treatment
- Independently developed vision counterpoint system, easy to operate
- Quartz bar base with built-in light source for real-time DDIC alignment monitoring
- Panasonic servo motors paired with HIWIN linear guides for precise positioning
