EN-50C
Constant-temperature Final Bonding Machine
$625 USD(≈ ¥4,500 RMB)
Bonding Machine
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Technical Specifications
| Dimensions | 330 × 430 × 500 mm |
| Net Weight | ≈ 18 kg |
| Voltage | AC220V 50/60Hz |
| Power | 650 W |
| Air Source | 0.4 – 0.6 MPa |
| Heater Size | 64 × 1.2 mm (customizable) |
| Bonding Precision | ±5 μm |
| Platform Size | 110 × 175 mm |
| Applicable Product | 2.4 – 7.9 inch |
| Packaging Size | 350 × 450 × 550 mm |
System Configuration
| Control System | Time controller (time setting) |
| Temperature Control | Constant heating 30-400 ℃, BERM high-speed PID control ±3 ℃, SSR, 150W×4 heating tubes, MISUMI insulation |
| Heater | Tungsten steel 64×1.2 (customizable), quartz strip |
| Alignment | None — mechanical positioning blade position |
| Pressure Control | SMC precision pressure valve 0.1-0.6 MPa (down-pressure + de-weight), digital pressure gauge |
| Actuation | SMC cylinder, HIWIN linear guideway, solenoid valve |
| Safety | 16A leakage protection, 15A fuse, emergency stop |
Key Features
- Desktop, compact and lightweight, ideal for small-batch rework
- Bonding position indicated by positioning blade for precise alignment
- SMC low-friction cylinder with de-weight adjustment allows extremely low pressure to minimize indentation
- Suitable for COP display/touch flex without flipping the screen
- Suitable for iPhone external COP touch flex and display flex final bonding, with flip positioning for quick alignment