EN-590S
DDIC/FPC-to-panel alignment and final bonding machine
$2,500 USD(≈ ¥18,000 RMB)
DDIC Machine
Technical Specifications
| Dimensions | 600 × 600 × 850 mm |
| Net Weight | 64 kg |
| Working Environment | Dust-free clean room, 22-25 ℃, 40%-60% RH, ESD grounded |
| Voltage | AC220V 50/60Hz (AC110V customizable) |
| Power | Rated 800 W; Max 1120 W |
| Heater Size | Tungsten steel 40×3.0 mm (customizable) |
| Bonding Precision | ±3 μm |
| Panel Platform | 180 × 170 mm / inclined platform |
| Packaging Size | 650 × 610 × 1010 mm |
| Packaging Weight | 85 kg |
System Configuration
| Control System | 4.3-inch smart touch screen |
| Temperature Control | Constant heating 30-300 ℃, heater + bottom mold heating, Autonics PID ±2 ℃, SSR, K-type thermocouple, MISUMI insulation |
| Alignment System | Down-lens alignment, high-resolution color CCD two channels, 14-inch HD monitor |
| Pressure Control | SMC precision pressure valve (bonding + de-weight), digital pressure gauge |
| Adjustment | FPC/DDIC adjustment platform XYθ+Z, DDIC vacuum adsorption |
| Actuation | Panasonic servo motor + SMC low-friction cylinder + HIWIN precision ballscrew + linear guideway |
| Safety | 32A leakage protection (IEC61009-1), 16A fuse, emergency stop, ESD grounding |