AC-7813KM-25 1.2mm × 50m
ACF Anisotropic Conductive Film (bonding consumable)
$25 USD(≈ ¥180 RMB)
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Bonding Consumable
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Technical Specifications
| Brand | Hitachi |
| Adhesive Thickness | 25 μm |
| Conductive Particles | Ni gold-plated resin balls |
| Particle Diameter | 5 μm |
| Particle Density | 5000 pcs/mm² |
| Min Electrode Pitch | 25 μm |
| Min Contact Area | 13000 μm² |
| Pre-bonding Conditions | 60-100°C, 1-3s, 1MPa |
| Main Bonding | 165-170°C, 5s, 2-4MPa |
| Storage Conditions | -20±5°C frozen, warm 30-60min before opening |
| Typical Applications | Phone LCD/OLED FOG, iPhone 11-13 screen repair, general large-screen FOG bonding |
| Features | Highly versatile, highest repair-market volume, high fault tolerance |
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