EN-590 vs EN-590S — Configuration Differences

EN-590 vs EN-590S — Configuration Differences (with EN-801S Pre-bonding Machine)

How to choose between the ZJWY EN-590 and EN-590S bonding machines, and where the EN-801S pre-bonding machine fits in.

Configuration difference chart: EN-590 vs EN-590S. EN-801S is only used for aligning LCD and IC; after alignment, EN-590 is required for IC main bonding. EN-590 adopts an outward-extending open platform and requires no fixture. EN-590S can directly bond DDIC, adopts a built-in platform structure and an IC flip fixture.
EN-590 与 EN-590S 配置区别对照图：EN-801S 预压机仅用于对位液晶与 IC，对位好后需使用 EN-590 完成 IC 本压；EN-590 采用外伸式平台、无需治具；EN-590S 可直接邦定 DDIC，采用内嵌式平台并配备 IC 翻盖治具。

At a glance

Item EN-590 EN-590S
Role Main bonding machine (pulse final bonding) Main bonding machine with integrated DDIC bonding
DDIC bonding Requires prior LCD/IC alignment on the EN-801S, then IC main bonding on the EN-590 Can directly bond DDIC — no separate pre-bonding step required
Platform structure Outward-extending open platform Built-in platform structure
Fixture No fixture required IC flip fixture
Typical use Shops that already run an EN-801S alignment station Shops needing a single machine for direct DDIC bonding

What the EN-801S does

  • The EN-801S is only used for aligning the LCD and the IC.
  • After alignment is completed, the EN-590 is required to perform IC main bonding.
Buying guide: Choose EN-590 if you already have (or plan to buy) an EN-801S alignment machine and want an open, fixture-free platform. Choose EN-590S if you want one machine that can directly bond DDIC with its IC flip fixture.

View EN-590 Details
View EN-590S Details
View EN-801S Details

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